FISCHER ELEKTRONIK ICK BGA 27 X 27 X 22 Heat Sink, Square, PCB, For Ball Grid Arrays, BGA, 13.5 °C/W, 22 mm, 27 mm, 27 mm Hosa Technology YRA-154 subtly darkens skies Application Foliage
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Ships within 48 hours · Estimated delivery Sep 26 - Oct 1